Advanced Packaging Technology Development Engineer: Advance PKG stacking
Core
Develop and transfer next-generation semiconductor packaging technologies (flip chip, TCB, hybrid bonding) from development to high-volume production.
Role type
Senior IC advanced packaging technology development engineer
Builds
Next-gen memory and storage packaging solutions for data centers, AI, and mobile applications
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Semiconductor process development, DOE design and execution, failure analysis, data analysis, process characterization, cross-functional collaboration, technical documentation, troubleshooting, AI/automation tool application
Preferred skills
Experience with flip chip, TCB, and hybrid bonding processes, knowledge of advanced packaging materials
Technologies
Flip chip, TCB, hybrid bonding, FDC, SPC
Responsibilities
Explore new semiconductor packaging technologies; Set up and execute DOE plans; Build samples and perform data analysis; Lead troubleshooting to improve process efficiency; Prepare documentation for process transfer from TD to HVM; Review process stability using FDC, SPC, and test results
Seniority
Senior, hands-on IC