DMTS Process Development Engineer, Advanced Packaging
Core
Lead advanced packaging process development for next-gen memory products (HBM, 3DS DRAM) from pathfinding to manufacturing readiness.
Role type
Senior IC process development engineer (advanced packaging)
Builds
Production-ready advanced memory and storage solutions
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features
Required skills
Semiconductor process development, wafer-level/die-level processes (CMP, etch, thin films, hybrid bonding), process integration, cross-functional program leadership, data-driven decision-making, AI/advanced analytics application
Preferred skills
PhD in relevant field, advanced memory/3D packaging architecture expertise, technical mentoring, materials characterization and simulation
Technologies
CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, molding, AI-enabled tools, automation, advanced modeling
Responsibilities
Own advanced packaging process technologies across wafer-level and die-level modules; Develop and mature novel process flows, materials, and integration schemes; Lead FOAK development and supplier engagement; Drive structured problem solving for multi-domain technical challenges; Lead technology transfer to manufacturing; Leverage AI-enabled tools and data analytics to accelerate process development
Seniority
Senior, hands-on IC with strategic influence