Director, Advanced Packaging Technology Development
Core
Strategic and technical leadership for developing scalable, manufacturable assembly processes enabling next-generation memory products (2.5D, 3DIC, hybrid bonding, HBM).
Role type
Director, Advanced Packaging Technology Development (Strategy & Hands-on IC)
Builds
Scalable manufacturing solutions for advanced packaging technologies (die attach, hybrid bonding, molding, substrate assembly) for next-gen memory products.
Domain
Semiconductor manufacturing / Advanced Packaging / Memory Solutions
Required skills
Advanced packaging process development, 2.5D/3D packaging technologies, hybrid bonding, HBM/heterogeneous integration, reliability engineering, yield improvement, statistical process control, DOE, cross-functional leadership, strategic roadmap planning, supplier partnership management.
Preferred skills
AI-enabled process optimization, data science methodologies, advanced analytics, capital strategy planning, global team management.
Technologies
JMP, Python, R, SQL, semiconductor manufacturing equipment, advanced assembly materials.
Responsibilities
Develop advanced packaging process technology strategies aligned with long-term roadmaps; lead process development from concept through qualification and manufacturing transfer; drive innovation in die attach, hybrid bonding, and molding; build and develop high-performing technical organizations; partner with cross-functional teams (Design, Manufacturing, Supply Chain); influence organizational investment decisions; establish performance metrics and continuous improvement initiatives.
Seniority
Director, strategic leadership with hands-on technical execution