Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
Core
Lead a team to develop and integrate advanced 2.5D/3D packaging technologies (HBM, hybrid bonding) from concept to full-scale manufacturing for next-gen AI and HPC products.
Role type
Senior IC Process Integration Lead (Advanced Packaging)
Builds
Next-generation multi-die solutions, 2.5D/3D packaging platforms, HBM implementations
Domain
Semiconductor manufacturing, Advanced Packaging, AI/HPC hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging technology development, 2.5D/3D stacking, HBM integration, hybrid bonding (W2W/C2W), warpage engineering, DOE, process analysis, yield/reliability improvement, technology transfer, cross-functional collaboration
Preferred skills
Scaling R&D to manufacturing, statistical process control, defect reduction, warpage modeling, material characterization, package reliability qualification, technical publications/patents
Technologies
TSV, underfill, molding, bonding, inline metrology, AI-enabled engineering workflows
Responsibilities
Manage team for process integration across 2.5D/3D platforms; Spearhead development/optimization/qualification of emerging packaging tech; Improve yield/reliability via defect analysis and data-driven investigation; Lead technology transfer to manufacturing; Partner with design/process/test teams to scale solutions; Predict/mitigate wafer/die warpage via modeling and controls
Seniority
Director, hands-on IC with mentorship