Semiconductor Package Electrical Engineer
Core
Design high-speed electrical interfaces and interconnects for semiconductor packages, optimizing silicon layout and package design through modeling and validation.
Role type
Senior IC electrical engineer (semiconductor packaging)
Builds
High-performance memory and storage packages (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features
Required skills
High-speed interface design, electrical model extraction, frequency domain modeling, transient time domain analysis, circuit design collaboration, test plan execution, system-level correlation, AI/automation solution development
Preferred skills
Electromagnetics, Microwave theory, Antenna theory, RF circuits
Technologies
Ansys, Siemens, Cadence
Responsibilities
Work on electrical and physical design of high-speed interfaces in packages; Work on electrical model extraction and validation of package interconnects; Electrical modeling, simulation and characterization of high-speed interfaces; Develop and execute test plans to validate package electrical models; Work with product engineering and system engineering for package correlation and validation; Translate engineering problems into scalable Artificial Intelligence and automation solutions
Seniority
Senior, hands-on IC
