Staff Engineer, Advanced Packaging Technology Development
Core
Lead the development of world-class packaging technologies for memory and storage solutions, driving technical innovation and strategic roadmaps.
Role type
Staff Engineer, Advanced Packaging Technology Development
Builds
High Bandwidth Memory, 2.5D/3D integration strategies, and Hybrid bonding solutions
Domain
Semiconductor manufacturing, Advanced Packaging, Memory/Storage
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging engineering, High Bandwidth Memory expertise, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, 3D stacking process, DRAM manufacturing, OSAT operations
Preferred skills
DRAM wafer structure knowledge, East Asian languages, AI-enabled engineering tools, data analytics platforms, patent inventions
Technologies
AI-assisted tools, data analytics platforms, digital technologies
Responsibilities
Deliver differentiated technology solutions, collaborate with internal/external partners, consult on senior management decisions, lead multi-disciplinary teams, analyze competitive trends, create packaging technology roadmaps, improve engineering efficiency via AI/automation, define technical requirements, troubleshoot sophisticated issues, promote cost reduction and quality initiatives
Seniority
Staff, hands-on IC with strategic leadership