Principal/Senior Advanced Packaging Development Process Engineer
Core
Lead technology development and qualification of next-generation advanced packaging solutions for future memory and semiconductor products, including hybrid bonding, TCB, and flip chip.
Role type
Principal/Senior Advanced Packaging Development Process Engineer
Builds
Next-generation memory and semiconductor products enabled by advanced packaging technologies
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE methodologies, statistical process control, root-cause analysis, process characterization, defect reduction, cross-functional collaboration, project management, technical documentation, SPC/FDC monitoring, AI/automation tool application
Preferred skills
HBM/2.5D/3D packaging, chiplet integration, failure analysis, material characterization, high-volume manufacturing transfer, supplier engagement, advanced metrology
Technologies
Hybrid Bonding, Thermo-Compression Bonding (TCB), Flip Chip, SPC, FDC, AI/ML tools, advanced metrology equipment
Responsibilities
Develop and qualify advanced packaging processes; design and analyze DOE experiments; lead process setup and optimization; perform technical data analysis and root-cause investigations; collaborate on technology integration; evaluate new materials and equipment; drive yield improvement and defect reduction; maintain process documentation and qualification reports; monitor process health using SPC and metrology; support customer sample builds and technology milestones; apply AI and automation to improve efficiency; lead strategic technology initiatives.
Seniority
Senior, hands-on IC with strategic initiative leadership
