FE CPIE RDA Defect Engineering Snr Engineer/Principal Engineer
Core
Drive HBM defectivity improvement and optimize manufacturing performance by aligning global peer groups and leveraging worldwide resources to close big rock performance gaps.
Role type
Senior/Principal Process Integration Engineering (Defect Analysis)
Builds
High Bandwidth Memory (HBM) manufacturing solutions and global process standards
Domain
Semiconductor manufacturing (Memory/Storage)
Required skills
Global manufacturing strategy, defect analysis, yield optimization, cross-functional collaboration, project management, supplier quality management, process integration, change management, stakeholder alignment
Preferred skills
Experience with High Bandwidth Memory (HBM), Best Known Methods (BKM) implementation, Copy Smart Team (CST) leadership, international travel readiness (via careerplan.io/jobs/23401803-fe-cpie-rda-defect-engineering-snr-engineerprincipal-engineer-at-micron)
Technologies
Semiconductor fabrication equipment, manufacturing execution systems, project management tools
Responsibilities
Facilitate global peer groups to align on strategy and roadmap for manufacturing capability improvement; prioritize resources to close performance gaps; manage project lifecycles from definition to review; coordinate supplier quality engineering and equipment groups; drive continuous improvement projects for yield, quality, and cost optimization.
Seniority
Senior/Principal, strategic leadership with hands-on execution