Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)
Core
Lead a high-performing team to drive intrinsic and extrinsic reliability test development, execution, and DPM reduction for Micron's latest High Bandwidth Memory (HBM) products.
Role type
Principal Engineer / Member of Technical Staff (HBM Product System Engineering)
Builds
HBM DRAM and Interface die products with optimized manufacturing test flows
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Statistics and data analysis, Circuit analysis, AI/ML application (regression, classification, anomaly detection), Cross-functional collaboration, Team leadership, Project management
Preferred skills
Product Engineering experience, AI-first mindset, Mentoring engineers on AI adoption
Technologies
Claude code, Agentic AI, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA)
Responsibilities
Define reliability stress test flows and plans; Drive extrinsic and intrinsic reliability improvements; Debug and resolve qual/RMA failures via failure analysis; Provide recommendations for fab process conversions to improve yield and reduce cost; Manage risks associated with process conversions; Mentor team members on AI adoption and technical skills; Collaborate with Fab, Design, and Quality teams on process conversions and yield improvements.
Seniority
Principal, hands-on IC with team leadership