Sr. Assembly TD Engineer: Advance PKG stacking
Core
Developing next-generation semiconductor packaging technologies, specifically flip chip, TCB, and hybrid bonding processes, to enable advanced memory and storage solutions.
Role type
Senior IC advanced assembly technology development engineer (packaging)
Builds
Next-gen packaging processes and materials for high-volume production
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Flip chip process development, TCB process development, hybrid bonding process development, DOE planning and execution, data analysis, process troubleshooting, process transfer management, FDC/SPC review
Preferred skills
Wet processing, surface cleaning, plasma surface activation, plasma-based dry etching, AI/automation tools for process development
Technologies
Flip chip, TCB, hybrid bonding, FDC, SPC
Responsibilities
Explore new semiconductor technologies (flip chip, TCB, hybrid bonding), set up and execute DOE plans, build samples and perform data analysis, troubleshoot processes to improve efficiency, prepare documentation for process transfer from TD to HVM, review process stability using FDC and SPC
Seniority
Senior, hands-on IC
