Senior/Staff Process Engineer (Flip Chip)
Core
Owns process development and technical support for Flip Chip assembly of silicon photonic chip wafers, including plasma cleaning, flux engineering, pick & place, reflow, underfill, and curing.
Role type
Senior/Staff Process Engineer (Flip Chip)
Builds
Silicon photonic chip wafers via Flip Chip assembly
Domain
Semiconductor manufacturing / Silicon Photonics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Flip chip assembly process development, DOE design and execution, material characterization and qualification, failure analysis and root-cause diagnostics, SPC control plan establishment, FMEA, 8D problem-solving, finite element simulation for warpage and thermal stress, JMP/Minitab proficiency
Technologies
JMP, Minitab
Responsibilities
Optimize process integration with upstream processes to increase yield, lead reliability validations (TCT, HAST, HTS), manage incoming material quality control, compile process SOPs and engineering change documents, support NPI new product introduction
Seniority
Senior/Staff, hands-on IC
