Senior Engineer, HIG HBM Package PE
Core
Lead and develop a high-performing team to drive Package PE activities for Next Generation HBM products, focusing on Quality, Cost, Cycle Time, and Scale.
Role type
Senior IC Product Engineering Manager (HBM Packaging)
Builds
High-performance HBM memory and storage products
Domain
Semiconductor manufacturing / Memory and Storage
Deliverable
production ML models | product features
Required skills
Semiconductor industry experience, Product Engineering, Packaging, Team Leadership, Yield Improvement, Data Analysis, Cross-functional Collaboration, Process Conversion, AI/ML tool deployment
Preferred skills
Micron experience, Electrical Engineering background
Technologies
Statistical tools, Machine Learning, AI, Agentic AI
Responsibilities
Improve assembly coverage to reduce Time 0 and Field DPM; Drive down HBM Cube on Wafer Assembly Yield Loss; Own Cumulative Yield with cross-functional teams; Manage Qual/Package Qual and RMA Packaging issues; Establish robust Process Conversion Business Processes; Utilize AI/ML for engineering data analysis and yield improvement; Create deviation alert systems for yield loss and trends; Mentor and develop team members; Promote innovation to maintain competitive edge.
Seniority
Senior, hands-on IC with leadership responsibilities