Senior Engineer/ Engineer – Package Silicon Integration Engineer
Core
Integrate new silicon technologies with package platforms for memory applications, utilizing virtual prototyping and simulation to resolve integration challenges and define design rules.
Role type
Senior IC package silicon integration engineer
Builds
Memory applications (DRAM, NAND, NOR) and next-generation technology enablement (3DS, HBM)
Domain
Semiconductor manufacturing, memory and storage solutions
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
IC package development, CPI concepts, test vehicle development, front-end fab processes, BEOL integration, DOE planning, cross-functional project coordination, analytical problem-solving
Preferred skills
Virtual prototyping, multi-physics simulation (FEA, thermal, electrical), AI/ML tools for data automation, semiconductor fabrication knowledge
Technologies
FEA, thermal simulation, electrical modeling, 3DS, HBM
Responsibilities
Develop integration plans for new silicon and package platforms; execute test vehicle strategies and Design of Experiments (DOEs); correlate simulation outputs with physical characterization data; define mechanical characterization architectures; translate learnings into design rules and stack-up guidance; partner with global R&D and manufacturing teams to resolve integration challenges.
Seniority
Senior, hands-on IC
