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Senior Engineer, HIG HBM Media Health

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-07-14 → 2026-07-31

Core

Lead HBM product development, validation, and manufacturing test optimization to ensure quality, cost efficiency, and scale for next-generation memory solutions.

Role type

Senior IC Product Engineering Manager (HBM)

Builds

High-bandwidth memory (HBM) products for data centers and AI applications

Domain

Semiconductor manufacturing and memory technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

HBM product development, manufacturing test optimization, circuit analysis, Verilog simulation, yield improvement, root cause analysis, process conversion, technical decision making, team mentorship, project management

Preferred skills

Python programming, logic gate/transistor operation knowledge, circuit simulation/debug, DRAM operation familiarity, semiconductor process knowledge, AI tool usage

Technologies

Verilog, CAD tools, Python, AI tools (Claude code)

Responsibilities

Optimize test coverage for HBM design architectures and process nodes; Develop, validate, and qualify next-generation HBM products; Improve manufacturing test yields and reduce test time; Resolve device qualification and RMA issues; Recommend process conversions to fab teams; Mentor team members; Make final decisions on risk analysis and project prioritization; Collaborate with cross-functional teams (Fab, Design, System, Test, Quality)

Seniority

Senior, hands-on IC with leadership responsibilities

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