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Field Applications Engineer

Taipei - MTT office, Taiwan💼 Full-time🗓 2026-06-15 → 2026-07-30

Core

Field Applications Engineer supporting High Bandwidth Memory (HBM) customers with technical expertise, qualification, and problem-solving.

Role type

Senior IC Field Applications Engineer (HBM/DRAM)

Builds

HBM memory solutions and qualification for customer systems

Domain

Semiconductor memory (HBM, DRAM, GDDR) and compute systems

Deliverable

client delivery

Required skills

HBM design-in, lab design and deployment, DRAM/systems engineering, failure analysis, oscilloscope and logic analyzer usage, memory architecture advice, technical training delivery, cross-functional collaboration

Preferred skills

HBM experience, advanced packaging/integration experience, quality and reliability experience

Technologies

HBM, GDDR, DRAM, AI platforms, Microsoft Office

Responsibilities

Align HBM programs with key customers, extend technical relationships, complete qualification and debug issues, influence engagement strategies, develop strategic plans with Sales, identify new business and discuss future needs, solve technical challenges and act as central contact for critical issues, provide memory architecture advice and training, interface with validation teams

Seniority

Senior, hands-on IC

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