Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Drive intrinsic and extrinsic reliability test development and execution for High Bandwidth Memory (HBM) products, focusing on DPM reduction and root cause analysis for defectivity and reliability failures.
Role type
Senior IC reliability and system engineering engineer (semiconductor)
Builds
HBM DRAM and interface die products for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing and reliability engineering
Required skills
Reliability test flow development, Failure analysis (EFA/PFA), CMOS technology knowledge, DRAM architecture understanding, Data analysis and statistics, Python scripting, Root cause analysis, Process conversion management, Risk management, Cross-functional collaboration (via careerplan.io/jobs/37811953-engineer-product-system-engineering-media-health-reliability-heteregenous-integration-high)
Preferred skills
Semiconductor device coursework, Circuit design experience, Product validation experience, JMP usage
Technologies
Python, JMP, CMOS, DRAM
Responsibilities
Define and develop reliability stress test flows and plans; Manage qualification execution and gating issue resolution; Drive DPM reduction through optimized manufacturing test strategies; Debug and resolve qual/RMA failures via electric and physical failure analysis; Provide recommendations for fab process conversions to improve yield and reduce cost; Manage risks associated with DPM process conversions; Promote innovation in reliability testing; Lead project execution and technical decision-making for reliability initiatives.
Seniority
Senior, hands-on IC
