Advance Packaging Process Development Engineer
Core
Developing, configuring, and optimizing Package Assembly processes (front end, bonding, and back end) for memory product ramp-up, including side-by-side certification with Manufacturing teams.
Role type
IC process development engineer (semiconductor packaging)
Builds
Memory products (DRAM, NAND, NOR) and innovative package technologies (HBM, TSV, Bumping)
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process development, data interpretation, measurement analysis, change control management, cross-functional collaboration, troubleshooting, process optimization
Preferred skills
HBM integration, TCB, CMP, Ball Mount, Flip Chip, Underfill, Hybrid bond, Glass carrier bond/de-bond, wafer level molding/ball mount
Technologies
TCB, CMP, PVD, CVD, TSV, Bumping, Wafer Level Package
Responsibilities
Develop and optimize package assembly processes, assess processes via measurements and data interpretation, run and test systems and processes, approve material/process/equipment changes in CCB, work with Design teams globally
Seniority
Junior to Mid-level, hands-on IC
