Engineering Excellence Engineer 2
Core
Identify, diagnose, and resolve assembly process problems while leading continuous yield improvement and cost reduction activities for memory and storage manufacturing.
Role type
Manufacturing process engineering lead
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (memory and storage)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly process troubleshooting, process optimization, yield improvement, cost reduction, supplier quality management, SPC/FDC/RMS/APC support, site-to-site portability validation
Preferred skills
New product introduction (NPI) validation, material evaluation, audit management
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC; Manage and audit material suppliers to achieve quality, cost, and risk management objectives; Support internal and external audits