MTS Advanced Package Technology Development
Core
Shape advanced packaging technology roadmaps and enable technology within Micron's Advanced Package Technology Development team.
Role type
Senior IC strategy & technology development engineer (advanced packaging)
Builds
Leading-edge packaging technologies for memory and storage solutions
Domain
Semiconductor industry, advanced packaging, DRAM technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
failure analysis methodologies, DRAM technology expertise, frontend fab process integration, module process knowledge, silicon integration understanding, simulation tools proficiency, data analytics platforms, project management, technical writing/patents
Preferred skills
cross-functional team collaboration, competitive trend analysis, strategic decision making
Technologies
simulation tools, data analytics platforms
Responsibilities
Guide development of packaging technology roadmaps, assess competitive metrics through data intelligence, define requirements with proven technical data, innovate through patents and technical presentations, consult and influence technical decisions at senior management levels, analyze competitive trends to improve competitive edge
Seniority
Senior, hands-on IC with strategic leadership