Substrate Packaging Research and Development Engineer
Core
Develop and optimize advanced semiconductor packaging processes, materials, and equipment for high-volume manufacturing to ensure quality, reliability, and efficiency.
Role type
Senior IC packaging process engineer
Builds
Next-generation substrate packaging solutions for high-performance and mobile computing applications
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
DOE, statistical data analysis, SPC, material characterization, process optimization, equipment configuration, supplier management, technical documentation
Preferred skills
Optics, lasers, laser micro-machining, micro-fabrication
Technologies
Semiconductor packaging equipment, material characterization tools
Responsibilities
Develop and optimize advanced packaging processes and materials; Design process specifications and equipment configurations; Conduct DOE to characterize process windows; Drive continuous improvement for process capability and productivity; Collaborate with cross-functional teams to resolve technical challenges; Establish material specifications and partner with suppliers; Document process innovations via technical reports
Seniority
Senior, hands-on IC
