Packaging Module Development Engineer
Core
Develop First Level Interconnect (FLI) and advanced semiconductor packaging assembly solutions for mobile, edge, and hyperscale computing platforms.
Role type
Senior IC packaging module development engineer
Builds
Next-generation semiconductor packaging equipment, materials, and fabrication processes for high-volume manufacturing
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Mechanical/Materials/Electrical/Physics engineering, equipment development, process optimization, project management, statistical process control (SPC), design of experiments (DOE), Python/MATLAB programming, AI/ML concepts
Preferred skills
Semiconductor foundry experience, complex technical project delivery
Technologies
Python, MATLAB, SPC, DOE
Responsibilities
Develop FLI to support future packaging platforms; optimize assembly processes for quality, reliability, cost, yield, and manufacturability; lead equipment development from pathfinding to high-volume manufacturing; provide sustaining engineering support for equipment performance; respond to foundry customer escalations and manufacturing events
Seniority
Senior, hands-on IC with technical leadership
