Advanced Packaging Process Engineer
Core
Develop, optimize, and qualify advanced semiconductor packaging processes and equipment for high-volume manufacturing to ensure quality, reliability, and yield.
Role type
Senior IC packaging process engineer
Builds
Semiconductor packaging modules and systems for Intel products
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Process development, equipment qualification, Statistical Process Control (SPC), Design of Experiments (DOE), semiconductor fabrication, packaging flows (flip chip, fan-out, 2.5D/3D integration), data analysis, Python/MATLAB/SQL, quality systems, documentation standards, packaging reliability evaluation
Preferred skills
Data analysis and risk assessment methodologies, programming languages (Python, MATLAB, SQL), quality systems, documentation standards, packaging reliability evaluation tools
Technologies
Python, MATLAB, SQL
Responsibilities
Develop and optimize packaging assembly processes and equipment; Design and execute experiments using SPC and DOE to characterize processes; Innovate new techniques, materials, and tools; Collaborate with cross-functional teams to identify technical risks; Establish specifications for materials and equipment; Document and communicate technical findings; Lead standardization efforts for manufacturing systems
Seniority
Senior, hands-on IC
