TD Media and Collaterals Development Engineer
Core
Develop and optimize assembly media and collaterals to improve reliability, manufacturability, and cost efficiency for Intel's semiconductor packaging.
Role type
Packaging Module Development Engineer
Builds
Assembly media and collaterals for semiconductor packaging
Domain
Semiconductor manufacturing / Packaging technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical design, Statistical methods (DOE, SPC), Equipment engineering, Process engineering, Thermal and environmental testing, Risk mitigation, Technical documentation
Preferred skills
SolidWorks, AutoCAD, Semiconductor packaging process knowledge, Concept-to-fabrication project experience
Technologies
SolidWorks, AutoCAD
Responsibilities
Design and implement new media and collateral solutions, Conduct evaluations under simulated field conditions (heat, humidity, cycling), Lead initiatives to mitigate quality and reliability risks, Provide technical consultation on media challenges, Document technical improvements through research papers and presentations
Seniority
Entry-level to Mid-level, hands-on IC
