可靠性工程师/Reliability Engineer
Core
Formulate and execute reliability test plans for semiconductor packaging finished and semi-finished products, conducting failure analysis and risk assessment to root-cause packaging process failures.
Role type
Reliability Engineer (Semiconductor Packaging)
Builds
Semiconductor packaging products
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging process knowledge, HAST/TC/HTOL/MSL/reflow soldering/high-low temp shock/humidity aging test execution, failure analysis, root cause analysis, AEC-Q100/JEDEC standards, 8D reporting, yield optimization, cross-functional collaboration
Preferred skills
None stated
Technologies
HAST, TC, HTOL, MSL, reflow soldering, high-low temperature shock, humidity aging
Responsibilities
Develop reliability test plans for semiconductor packaging products, execute reliability experiments (HAST, TC, HTOL, MSL, reflow, thermal shock, humidity aging), perform failure analysis and risk assessment, establish reliability standards and control specifications, drive process/equipment/design corrections for reliability issues, maintain reliability database
Seniority
Mid-level, hands-on IC
