Package Assembly Process Development Integration Engineer
Core
Define process integration roadmaps, establish workflows, and optimize manufacturing processes for Intel's advanced packaging programs to enhance product quality and yield.
Role type
Process Integration and Yield Engineer (Advanced Packaging)
Builds
Advanced packaging solutions and die-package architectures for Intel foundry business
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE planning, statistical process control, yield improvement, design rule validation, cost management, cross-functional collaboration
Preferred skills
Advanced packaging NPI methodology, characterization techniques (CSAM, Xray, XPS, FTIR, SEM, EDX), package design interaction knowledge
Technologies
DOE, statistical process control, CSAM, Xray, XPS, FTIR, SEM, EDX
Responsibilities
Manage development and baseline data collection activities, serve as key contact for process level issues, manage substrates and materials to meet forecasted costs and schedule, develop solutions utilizing statistical knowledge and problem-solving tools
Seniority
Mid-level, hands-on IC
