Packaging Module Development Engineer
Core
Develops assembly processes and equipment for semiconductor packaging platforms, optimizing manufacturing efficiency, quality, and reliability while ensuring manufacturability of physical layouts.
Role type
Senior IC packaging process and equipment development engineer
Builds
Semiconductor packaging assembly processes, equipment specifications, and qualification methods
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Design of Experiments (DOE), Statistical Process Control (SPC), data-driven root cause analysis, process development, characterization, optimization, qualification, material specification management, reliability engineering principles, accelerated stress testing, failure mechanism analysis
Preferred skills
Python, MATLAB, JMP, Minitab, statistical analysis tools
Technologies
Python, MATLAB, JMP, Minitab
Responsibilities
Develop assembly processes and equipment for future packaging platforms; optimize manufacturing efficiency for quality, reliability, cost, and yield; develop process specifications using DOE and data analysis; maintain equipment for evaluating silicon and package technologies under simulated field conditions; establish material specifications for vendors; develop new techniques for early identification of packaging quality issues; set reliability requirements and influence design/material selection; lead efforts in innovating and improving equipment and processes using statistical methods; provide consultation on packaging problems and process improvements.
Seniority
Senior, hands-on IC
