ENGR I, MANUFACTURING EQUIP; MFG
Core
Supporting assembly manufacturing equipment, driving equipment reliability, and leading New Product Introduction (NPI) activities for new package and product development.
Role type
Manufacturing Equipment Engineer (Semiconductor Assembly)
Builds
Semiconductor packages and products
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Die Attach, Wire Bond, Sintering, Molding, Singulation equipment operation, SPC, FMEA, 8D, DOE methodologies, machine recipe development, tooling design, process parameter optimization, yield improvement, cycle time reduction, productivity improvement, engineering documentation management
Responsibilities
Support assembly equipment uptime and OEE, lead equipment qualification for NPI programs, coordinate with Process/Product/Quality/Manufacturing teams, develop machine recipes and process parameters, support DOE and process characterization projects, drive yield and productivity improvements, maintain engineering documentation and compliance
Seniority
Mid-level IC