Packaging Module Development Engineer
Core
Develops assembly materials, processes, and equipment to enable advanced packaging platform technologies and optimize manufacturing efficiency for quality, reliability, and yield.
Role type
Senior IC packaging module development engineer
Builds
Novel materials technologies, manufacturing processes, and equipment specifications for semiconductor packaging
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Materials science fundamentals, process characterization, equipment optimization, Design of Experiments (DOE), statistical data analysis, failure mechanism analysis, supplier quality management, reliability testing, manufacturability analysis
Preferred skills
Cross-functional collaboration, package design and development, semiconductor reliability requirements, materials structure-property-performance behaviors, materials characterization techniques
Technologies
DOE tools, statistical analysis software, materials characterization tools
Responsibilities
Develop assembly materials, processes, and equipment for future packaging platforms; Optimize manufacturing efficiency for quality, reliability, cost, and yield; Develop process and equipment specifications using DOE and data analysis; Establish material specifications for contract assemblers and vendors; Ensure manufacturability of package design layouts; Develop new techniques for early identification of material quality and reliability problems; Set reliability requirements and influence design/material selection based on failure mechanisms; Lead innovation efforts using experimental design and statistical methods; Provide consultation on packaging problems and process improvements.
Seniority
Senior, hands-on IC
