Advanced Packaging Substrate Supplier Enablement Lead
Core
Lead substrate supplier development and qualification for advanced packaging technologies (high density FCBGA, EMIB-T, glass core) to enable manufacturing capacity and support customer demand.
Role type
Senior IC manufacturing enablement lead (advanced packaging)
Builds
Advanced packaging substrates and wafer assembly solutions for semiconductor customers
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
process integration methodologies, statistical analysis, coding techniques, low yield analysis, corrective actions, continuous improvement, quality and reliability risk assessment
Preferred skills
supplier management, technology enablement, strategic alignment
Technologies
high density FCBGA, EMIB-T, glass core substrate
Responsibilities
Define process integration roadmaps and establish manufacturing procedures; Extract insights from data to improve yield; Lead low yield analysis and corrective actions; Drive continuous improvement to minimize defects; Assess quality and reliability risks for material/process changes; Collaborate with internal teams and external stakeholders to align strategies
Seniority
Senior, hands-on IC