Package Development Engineer
Core
Lead the end-to-end development, qualification, and manufacturing release of advanced flip-chip packaging solutions (substrate-based and leadframe-based) to deliver high-performance, reliable, and cost-effective products.
Role type
Senior IC Package Development Engineer
Builds
Advanced flip-chip packages (FC-BGA, FC-LGA, FC-QFN, FC-DFN, DrMOS, SPS) for semiconductor products
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing release of packaging solutions)
Required skills
Flip-chip packaging technologies, FC-BGA/FC-LGA/FC-QFN/FC-DFN/DrMOS/SPS package design, leadframe and substrate packaging processes, package reliability and qualification, DOE/DFMEA/SPC/8D/statistical problem-solving, OSAT and supplier collaboration, NPI execution, root-cause analysis, project management
Preferred skills
None explicitly stated as preferred (all listed skills are required)
Technologies
ACAD, 8D, SPC, DFMEA, DOE
Responsibilities
Develop and optimize substrate-based and leadframe-based flip-chip package technologies, drive package architecture and material selection, support flip-chip integration processes (bumping, underfill, reflow, molding, singulation), develop qualification plans and assess reliability, lead root-cause investigations for package issues, collaborate with OSATs on yield improvement and cost reduction, support NPI execution and technology transfer to high-volume manufacturing
Seniority
Senior, hands-on IC