Senior Program Managers
Core
Lead qualification and capacity ramp-up for advanced substrate packaging and wafer assembly solutions, specifically EMIB-T technology for next-gen AI devices.
Role type
Senior Program Manager (Advanced Packaging)
Builds
Advanced packaging substrates and wafer assembly capacity for AI-era compute devices
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Capacity management, lead time analysis, yield improvement, structured problem solving, supplier influence, stakeholder management, process tool qualification, factory operations oversight
Preferred skills
Substrate process building blocks expertise (embedding, laser drilling, lamination, plating, metrology, testing), HVM/TD ramp experience, executive-level presentation
Technologies
EMIB-T, Process Control System (PCS), substrate manufacturing tools
Responsibilities
Collaborate with supplier engineering teams to advance substrate technologies; optimize bottleneck processes to reduce throughput time; oversee product and test vehicle delivery schedules; analyze substrate lead times and develop reduction roadmaps; ensure adherence to Process Control System commitments; design factory TV/product certification plans for yield improvement; develop micro-schedules for new factory startups; lead qualification activities and monitor ramp indicators; influence strategic decisions at senior supplier management levels.
Seniority
Senior, hands-on IC