Sr Staff Substrate Yield Lead
Core
Lead end-to-end yield improvement initiatives for next-generation advanced packaging technologies (EMIB-T) and cutting-edge semiconductor manufacturing processes.
Role type
Sr Staff Substrate Yield Lead (hands-on IC)
Builds
High-performance semiconductor manufacturing processes and advanced packaging platforms
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models
Required skills
Root cause analysis (RCA), statistical data analysis, JMP, SQL scripting, yield analysis methodologies, defect density reduction, semiconductor fabrication processes, process integration, manufacturing debug, fault isolation, failure analysis, design-for-test (DFT), machine learning techniques, design-for-manufacturing (DFM)
Preferred skills
Process design enablement, process development, equipment optimization
Responsibilities
Lead process yield ownership and drive corrective actions for yield excursions; Establish real-time yield monitoring dashboards and performance metrics; Serve as primary technical interface with substrate suppliers; Partner with design teams to optimize design rules and improve yield robustness; Apply advanced analytics or machine learning to improve yield prediction and defect classification.
Seniority
Sr Staff, hands-on IC