ATD Laser Development Engineer
Core
Design and develop laser assembly packaging processes and equipment for next-generation semiconductor packaging technologies.
Role type
IC packaging process engineer (laser assembly)
Builds
Semiconductor packaging modules and assembly equipment
Domain
Semiconductor manufacturing / Laser processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), laser and optical systems fundamentals, process optimization, failure mechanism analysis, manufacturability management
Preferred skills
Semiconductor packaging troubleshooting, equipment adjustment, process characterization, Data Science tools (Python, Numpy/Pandas, SQL, JMP, Minitab)
Technologies
JMP, Minitab, Python, Numpy, Pandas, SQL
Responsibilities
Design laser assembly packaging processes, optimize manufacturing for quality/yield/productivity, develop process specs using DOE, oversee physical layout manufacturability, establish laser process specs with suppliers, innovate quality screening techniques, set reliability requirements based on failure mechanisms
Seniority
Mid-level, hands-on IC
