Principal Engineer, Hybrid Bonding Module
Core
Define and scale next-generation hybrid bonding (HBI) technologies for high-performance computing, AI, and chiplet architectures, driving capability from first-of-a-kind development through high-volume manufacturing.
Role type
Principal Engineer, Hybrid Bonding Module
Builds
Next-generation hybrid bonding platforms and processes for advanced packaging
Domain
Semiconductor manufacturing / Advanced packaging / Die-to-wafer bonding
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (incorrect mapping, corrected below)
Deliverable
Physical/clinical work (Note: This is a manufacturing role, so the deliverable is physical work/processes)
Required skills
Hybrid bonding process development, First-of-a-kind (FOK) platform development, Yield and reliability improvement, Equipment development, Process integration, Technical mentorship
Preferred skills
Advanced packaging flows (chiplets, 2.5D/3D integration), Bond interface physics, Defect reduction strategies, Supplier engagement
Technologies
Hybrid bonding equipment, Wafer bonding tools, Process integration systems
Responsibilities
Define hybrid bonding technology roadmap and targets, Lead module-level process development and execution, Drive FOK equipment and platform development, Resolve systemic yield and reliability issues, Partner with equipment vendors and materials suppliers, Mentor and develop technical leaders
Seniority
Principal, strategy & mentorship