Test Module Development Engineer
Core
Develops test technology and processes for high-mix, low-volume semiconductor testing and future advanced packaging solutions.
Role type
Test Module Development Engineer
Builds
Test processes, equipment solutions, and repair reverse engineering for advanced packaging
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
process integration, equipment metrology, system design, material selection, parameter optimization, feasibility studies, theoretical simulations, vendor ecosystem collaboration
Preferred skills
reverse engineering, pathfinding development, manufacturing trend analysis
Technologies
semiconductor packaging equipment, metrology tools, simulation software
Responsibilities
Execute test technology development and enablement for high-mix, low-volume testing; implement design and development of sophisticated test processes and repair reverse engineering; execute pathfinding activities for advanced packaging roadmap; modify test equipment to improve efficiency and optimize production output; partner with suppliers to develop enabling technology elements; conduct technology feasibility studies via simulations and engineering methods.
Seniority
Individual Contributor