Quantum NCG 3DHI Engineer
Core
R&D bonding integration engineer developing 3D heterogeneous integration (3DHI) processes for quantum advanced packaging, including wafer-to-wafer and die-to-wafer bonding.
Role type
New College Graduate R&D process engineer (3DHI)
Builds
Novel wafer integration and packaging technology for quantum applications
Domain
Semiconductor manufacturing / Quantum technology / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
3DHI process development, wafer-to-wafer bonding, die-to-wafer bonding, OSAT collaboration, failure mode analysis, yield improvement, IP generation
Preferred skills
PhD level education, semiconductor packaging process knowledge, project management, leadership experience
Technologies
Wafer bonding tools, characterization resources, OSAT processes
Responsibilities
Drive 3DHI process development and planning with unit process engineers and tool/materials suppliers; Collaborate with OSATs to develop 2.5D and 3D heterogeneous integration processes; Develop expertise in processes, materials, and tooling; Drive mechanistic understanding of failure modes; Develop integration schemes to improve yields and reduce cycle time & costs; Generate IP related to novel wafer integration & packaging technology
Seniority
Entry-level (New College Graduate)
