Principal 3D-heterogeneous integration engineer
Core
Lead R&D efforts for advanced 3D Heterogeneous Integration (3D-HI) processes, including multi-die stacking and hybrid bonding, to enable new capabilities and early product prototyping for GlobalFoundries product lines.
Role type
Principal 3D-heterogeneous integration engineer (R&D)
Builds
Novel wafer integration and packaging technology processes for advanced packaging solutions
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
BEOL process integration, advanced bonding, TSVs, bump/wafer finish integration, wafer test/probe, OSAT collaboration, package development & assembly, design of experiment, failure mode analysis
Preferred skills
Leadership experience, project management, innovation in ambiguous environments
Technologies
BEOL, TSV, hybrid bonding, wafer-level integration, die-level integration
Responsibilities
Drive 3D-HI process development for building blocks required for advanced packaging solutions; Partner with unit process engineers, manufacturing engineers, and tool/material vendors; Collaborate on joint development projects (JDP) for 2.5D and 3D Heterogeneous Integration processes; Drive end-to-end process integration and planning for new capabilities and early product prototyping; Develop expertise in processes, materials, and tooling while utilizing characterization resources; Drive data analysis, interpretation of results, and understanding of failure modes; Identify and resolve process integration issues; Generate IP related to novel wafer integration and packaging technology; Mentor new hires
Seniority
Principal, hands-on IC with strategic oversight