Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications
Core
Lead end-to-end Chip-to-Package Interaction (CPI) qualification programs from concept through technology release, defining strategies, test vehicles, and reliability plans for next-generation semiconductor packaging solutions.
Role type
Senior Qualification Project Manager (Semiconductor Packaging)
Builds
Next-generation semiconductor packaging solutions and advanced technology platforms
Domain
Semiconductor manufacturing, packaging, and post-fab technologies
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CPI qualification strategy definition, cross-functional team leadership, OSAT partner management, reliability qualification planning, BEOL integration knowledge, risk mitigation, milestone readiness assessment, technical presentation
Preferred skills
Advanced packaging technologies (wirebond, flip-chip, WLP, 2.5D/3D, TSVs, chiplets), JEDEC/AEC-Q100 standards knowledge, global semiconductor environment experience, PMP certification
Technologies
Bumping, assembly, package-level testing, OSAT operations, BEOL processes, 2.5D/3D integration, TSVs, silicon interposers
Responsibilities
Define qualification strategies and success criteria; develop project plans, schedules, and budgets; coordinate cross-functional teams and external partners; drive test vehicle planning and qualification implementation; track project metrics and mitigate risks; lead technical reviews and milestone assessments; support customer engagements with status and results.
Seniority
Senior, hands-on IC