Package technology Reliability senior engineer/Technical manager
Core
Conducting risk assessments and reliability management for 2.5D/3D/CPO advanced packaging and board-level qualification.
Role type
Senior IC reliability engineer / Technical manager
Builds
Advanced semiconductor packages and board-level assemblies
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
New product risk assessment, Substrate electrical & physical analysis, Supplier audit & qualification, Quality incident handling, PCN management, Quality improvement project management
Preferred skills
Customer engagement for reliability concerns, Score card management
Technologies
2.5D/3D/CPO packaging, SBT (Substrate Bonding Technology)
Responsibilities
Perform new product risk assessment for 2.5D/3D/CPO advanced package & Board level qualification; Conduct substrate electrical & physical analysis for Advanced Package; Engage with customers on new product reliability concerns; Audit & qualify new assembly SBT suppliers; Manage assembly SBT supplier quality & reliability (incidents, PCN, audits, score cards); Oversee new product/technology introduction quality & reliability; Lead assembly SBT supplier quality improvement projects
