Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development )
Core
Director-level leader building and managing a team of 5–6 advanced package assembly and test engineers at a Taiwan OSAT supplier to drive development, qualification, and manufacturing readiness for advanced packaging programs.
Role type
Director, Advanced Package Assembly and Test Engineering (Supplier Development)
Builds
Advanced semiconductor packaging solutions (WLCSP, fan-out, TSV, flip chip, heterogeneous integration) for high-growth markets
Domain
Semiconductor manufacturing / Advanced Packaging / OSAT supplier development
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (semiconductor manufacturing execution)
Required skills
Advanced semiconductor packaging engineering, OSAT supplier management, NPI and qualification, yield improvement, failure analysis, team building and recruitment in Taiwan, cross-functional stakeholder management
Preferred skills
Building new engineering functions from scratch, high-speed interconnect or silicon photonics program experience, executive-level program visibility
Technologies
WLCSP, fan-out wafer-level packaging, TSV, flip chip, Cu pillar, micro-bump, die attach, substrate-based packages, heterogeneous integration
Responsibilities
Build and lead a Taiwan-based engineering team; Serve as primary technical interface with OSAT supplier; Drive assembly/test development, NPI, and qualification; Establish engineering operating mechanisms and risk management; Lead root-cause analysis and corrective actions; Recruit and retain top local engineering talent
Seniority
Director, hands-on technical leader with team management