Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development )
Core
Director-level leader to build, recruit, and lead a team of 5–6 advanced package assembly and test engineers at a Taiwan supplier, serving as the primary technical and execution interface to drive development, yield improvement, and manufacturing readiness.
Role type
Senior IC Director, Advanced Packaging Engineering & Supplier Development
Builds
Advanced semiconductor packaging solutions (WLCSP, fan-out, TSV, flip chip, heterogeneous integration) for high-growth markets
Domain
Semiconductor manufacturing / Advanced Packaging / OSAT Supplier Development
Required skills
Advanced semiconductor packaging engineering, Supplier development & management, Team building & talent retention, NPI & qualification, Failure analysis & root cause analysis, Yield improvement, Cross-functional stakeholder management, Technical leadership at supplier site
Preferred skills
OSAT supplier experience (ASE), Building new engineering functions from scratch, High-speed interconnect & silicon photonics programs, Package/test co-development
Technologies
WLCSP, Fan-out wafer-level packaging, TSV, Flip chip, Cu pillar, Micro-bump, Die attach, Substrate-based packages, Heterogeneous integration, Optical engine, Silicon photonics, Co-packaged optics
Responsibilities
Build and lead a Taiwan-based team of 5–6 engineers; Serve as senior technical interface with supplier; Lead advanced packaging development (architecture, process integration, reliability); Establish engineering operating mechanisms with supplier; Drive rapid learning cycles for yield and cycle time; Partner with internal product and technology teams; Recruit and retain top engineering talent in Taiwan; Lead root-cause analysis and corrective actions; Represent engineering leadership in supplier and customer reviews
Seniority
Director, hands-on IC leadership
