Advanced Packaging Cryogenic Modeling Engineer
Core
Develop and correlate cryogenic thermal, mechanical, and electrical models for semiconductor devices and advanced packaging to guide 3DHI technology optimization.
Role type
Senior IC cryogenic modeling engineer (multi-physics)
Builds
Cryogenic packaging and system co-optimization models for mechanical, thermal, and electrical performance
Domain
Semiconductor manufacturing / Advanced packaging / Cryogenics
Deliverable
production ML models | product features
Required skills
Cryogenic modeling, Multi-physics simulation, Semiconductor processes, Design of experiments, Thermal analysis, Mechanical stress analysis, Electrical simulation, Material property characterization, Boundary condition definition, Process flow simulation
Preferred skills
RF analog circuit design, LVS/DRC verification, Project management, Technical leadership
Technologies
Ansys Mechanical Workbench, Cadence, Keysight ADS, Mentors Graphics
Responsibilities
Develop cryogenic thermal, mechanical, and electrical models; Perform stress simulations for active areas; Anticipate integration/process issues; Facilitate discussions to drive optimal 3DHI technology decisions; Mimic cryogenic semiconductor process flows; Interact with integration, device, and design engineers
Seniority
Senior, hands-on IC
