Director – Advanced Packaging (Panel-Scale Technologies)
Core
Lead panel-scale packaging technology development for next-generation data center and AI accelerator products by defining technology direction, setting requirements, and driving execution through external ecosystem partners.
Role type
Director, Advanced Packaging Technology (Panel-Scale)
Builds
Next-gen data center and AI accelerator products via panel-level fan-out, large-format RDL, interposers, and die bonding solutions.
Domain
Semiconductor manufacturing / Advanced Packaging / Data Center Hardware
Required skills
Advanced packaging technology leadership, partner ecosystem management, 2.5D/3D packaging expertise, panel-level fan-out and RDL knowledge, die bonding technologies, DFM/DFY guideline development, yield and reliability engineering, cross-functional team leadership, technical roadmap definition.
Preferred skills
Experience with glass-core substrates, thermo-mechanical and signal integrity challenges in large packages, wafer-level assembly processes, high-volume manufacturing ramp leadership.
Technologies
Panel-level fan-out, RDL, interposers, die bonding, glass-core substrates, thermocompression bonding, hybrid bonding, mass reflow.
Responsibilities
Define panel-scale packaging technology roadmap and align partner roadmaps; lead technology development from concept to qualification; set technical requirements and guide materials/process selection; establish DFM/DFY guidelines; drive equipment and infrastructure readiness; resolve large-panel manufacturing challenges; establish yield/reliability targets and drive improvement plans; lead cross-functional teams and provide executive updates.
Seniority
Director, strategic leadership with hands-on technical direction