Packaging Design Engineer
Core
End-to-end package design execution for complex semiconductor products, focusing on substrate layouts, bump maps, and interposer designs for advanced packaging architectures.
Role type
Senior IC package design engineer (advanced packaging)
Builds
Advanced packaging solutions (2.5D/3D, chiplet-based) for AMD processors and AI technologies
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Substrate layout design, Bump map creation, Interposer design, EDA tools proficiency, Signal Integrity fundamentals, Power Integrity fundamentals, OSAT/Foundry collaboration, Design methodology definition
Preferred skills
Silicon Bridge design, Multi-project execution in high-pressure environments, Automation/AI-ML application in design flows, Design standardization expertise
Technologies
EDA tools, 2.5D/3D packaging stacks, Chiplet architectures
Responsibilities
Develop substrate layouts, bump maps, and interposer designs; Drive design decisions with SI/PI, mechanical, and SOC teams; Partner with OSATs and substrate suppliers; Define and enhance package design methodologies and flows
Seniority
Senior, hands-on IC
