Senior Staff Advance Packaging Designer
Core
Lead end-to-end package design execution for complex high-performance computing products, developing substrate layouts, bump maps, and interposer designs for 2.5D/3D and chiplet-based architectures.
Role type
Senior Staff IC Package Design Engineer
Builds
Advanced packaging solutions for data center and AI chips
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Substrate layout design, Bump map creation, Interposer design, 2.5D/3D packaging, Chiplet architecture, EDA tools, Signal Integrity, Power Integrity, OSAT/Foundry collaboration
Preferred skills
Silicon Bridge design, Multi-project execution, Design methodology definition, Mentorship
Technologies
EDA tools, OSAT platforms, Foundry flows
Responsibilities
Lead end-to-end package design execution for complex products, Develop substrate layouts, bump maps, and interposer designs, Drive design decisions through collaboration with SI/PI and SOC teams, Partner with OSATs and substrate suppliers, Define and enhance package design methodologies, Mentor junior engineers
Seniority
Senior Staff, hands-on IC with mentorship
