Senior Packaging Technical Engineer - Hardware
Core
Define chip pad ring, substrate interconnect scheme, and lead package layout design process to implement robust electrical packages.
Role type
Senior IC packaging engineer (hardware)
Builds
Chip floor plans, pad rings, substrates, and ball-out electrical packages
Domain
Semiconductor hardware / GPU / AI
Required skills
chip floor planning, pad ring design, substrate interconnect design, package layout design, transmission line theory, power delivery, signal integrity, Perl scripting, Python scripting, Tcl scripting, Cadence Skill, Excel
Preferred skills
board/system design experience, programming/scripting skills
Technologies
Cadence Skill, Perl, Python, Tcl, Excel
Responsibilities
Define chip pad ring and substrate interconnect scheme; Lead package layout design process; Collaborate with circuit, signal integrity, RTL, place and route, and system design teams; Work to define chip floor plan and ball-out
Seniority
Senior, hands-on IC
