Integrated Circuit - Packaging Architect Engineer
Core
Advanced packaging technology leader defining packaging architecture, roadmaps, and processes for client, server, gaming, and GPU products.
Role type
Senior IC packaging architect engineer
Builds
Novel package architectures and processes for AI, data centers, PCs, and gaming
Domain
Semiconductor manufacturing and advanced packaging
Required skills
Semiconductor technology development, packaging architecture definition, process definition, yield improvement, cross-functional team leadership, executive communication, DFM/DFY guidelines, test vehicle design, data analytics for yield
Preferred skills
Experience with OSATs and foundry partners, material science, thin film process development, defect reduction in fab/packaging environment
Technologies
Semiconductor packaging processes, DFM tools, DFY tools, yield data analytics
Responsibilities
Define package architectures and roadmaps with product architects; lead technology development from concept to qualification; drive test vehicle design and manufacturing; establish yield roadmaps and implement data analytic tools
Seniority
Senior, hands-on IC with leadership experience