Packaging Engineer II, New College Grad- Master's (Santa Clara, CA)
Core
Develop, implement, and maintain packaging designs for product assemblies and parts in the semiconductor industry.
Role type
Junior IC packaging engineer (new grad)
Builds
Semiconductor chip packaging and product assemblies
Domain
Semiconductor manufacturing / Materials engineering
Required skills
Packaging design, Material specifications, Root cause analysis, Cost-saving initiatives, Engineering Change Order (ECO) process, Basic training
Preferred skills
Master's degree in Mechanical or Packaging Engineering, GPA 3.0+
Technologies
Packaging equipment, Packaging materials
Responsibilities
Develop and maintain packaging designs, Generate piece-part and material specifications, Research and implement packaging materials and methods, Perform root cause analysis on packaging failures, Identify cost-saving initiatives, Release specifications via ECO process, Provide basic training to Packaging Engineer I
Seniority
Junior, New College Grad
