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Entry Level Talent for LPS (Master)

Leshan, Sichuan, China💼 Full-time🗓 2026-08-20 → 2026-09-26

Core

Develops packaging products and processes to meet requirements, ensuring quality, cost efficiency, and resistance to external variables while supporting cross-functional project goals.

Role type

Entry-level IC packaging design engineer

Builds

Packaging solutions for semiconductor/mechatronic products

Domain

Semiconductor / Mechatronics

Deliverable

product features

Required skills

packaging design, process development, design risk assessment, BOM management, DFMEA, lead frame design, tooling design, GMP understanding, integrity analysis

Preferred skills

none stated

Technologies

none stated

Responsibilities

Develop product/process to meet requirements; Provide design risk assessments and mitigation plans; Develop package roadmaps based on marketing/strategy; Prepare design drawings (lead frame, tooling); Prepare BOM documents; Maintain design documentation (DFMEA, rules, procedures)

Seniority

Entry-level, hands-on IC

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