Senior Member of Technical Staff (Advanced Packaging Pathfinding)
Core
Drive pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures, translating emerging concepts into scalable capabilities for semiconductor and display manufacturing.
Role type
Senior IC advanced packaging pathfinding engineer
Builds
Novel packaging concepts, integration approaches, and demonstration vehicles for next-gen chips
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Advanced packaging technologies, process integration, technology development, experimental validation, trade-off assessment, ecosystem collaboration, technical documentation, cross-functional leadership
Preferred skills
Heterogeneous integration, chiplet architectures, next-gen interconnect technologies, design–process co-optimization, patent/publication track record
Technologies
D2W, RDL, CoWoS, TSV, hybrid bonding, mixed interconnect architectures, advanced bumping strategies, next-gen substrates
Responsibilities
Drive long-range pathfinding exploration in advanced packaging; Lead hands-on development and feasibility studies for novel packaging concepts; Develop and validate new integration approaches; Perform deep technical analysis and trade-off assessments; Engage with stakeholders to translate customer requirements into technical problems; Mentor junior engineers and influence cross-functional teams
Seniority
Senior, hands-on IC with strategic influence