Staff Package Design Engineer
Core
Design and deliver high-performance 2.5D/3D, chiplet-based, FCBGA, SiP, and wire bond packages for industry-leading products.
Role type
Staff Package Design Engineer
Builds
Advanced silicon packages including 2.5D/3D IC, FCBGA, SiP, and multi-chip modules
Domain
Semiconductor packaging and advanced silicon integration
Required skills
Package CAD layout, 2.5D/3D IC packaging, FCBGA design, multi-die/chiplet design, substrate/RDL layout, bump mapping, escape routing, power/ground structures, DFM/DFA, DRC/LVS compliance, OSAT interface, Signal Integrity, Power Integrity, High-Speed Design
Preferred skills
Cross-domain co-design with silicon/SI/PI/thermal/reliability teams, ECO cycle management, version control
Technologies
Cadence Allegro Package Designer (APD/SiP), Siemens Xpedition, Innovator 3D IC
Responsibilities
Perform package layout design and development for advanced packages; Develop and maintain package CAD databases; Manage end-to-end design cycle including schematic creation and manufacturing output generation; Create and modify substrate/RDL layouts and power/ground structures; Work with SI/PI, thermal, and reliability teams for co-design; Ensure designs comply with foundry and manufacturing design rules
Seniority
Staff, hands-on IC
